Описание товара

800-BBDM : UEFI BIOS Boot Mode with GPT Partition
770-BCJI : A11 drop-in/stab-in Combo Rail s Without Cable Management Arm (A11)
750-ADWP : Front PERC Mechanical Parts, r ear load
634-CYDF : Dell Connectivity Module
631-AACK : No Systems Documentation, No O penManage DVD Kit
611-BBBF : No Operating System
605-BBFN : No Media Required
528-CTIC : iDRAC9, Enterprise 16G
470-BBMJ : 2.5" Chassis with up to 8 NVMe Drives, RAID Config, 2 CPU, P ERC11
461-AAIG : Trusted Platform Module 2.0 V6
450-AADY : C13 to C14, PDU Style, 10 AMP, 6.5 Feet (2m), Power Cord
405-AAZE : PERC H755N Front
400-ABHL : No Hard Drive
389-FBMB : PowerEdge R660xs HS5610 Label, No CE or CCC Marking, for abo ve 1300W PSU
387-BBEY : No Energy Star
384-BDJD : Very High Performance Fan X7
384-BBBH : Power Saving BIOS Settings
379-BFXT : Dell Connectivity Client - Dis abled
379-BEGI : C31, No RAID with NVMe and fro nt PERC
379-BCSF : iDRAC,Factory Generated Passwo rd
379-BCQX : iDRAC Service Module (ISM), NO T Installed
379-BCQV : iDRAC Group Manager, Enabled
370-AAIP : Performance Optimized
350-BCEM : No Quick Sync
340-DFKL : PowerEdge R660xs, 10x2.5, 4x3. 5 Long Drive Shipping Material
338-CNWK : PowerEdge R660xs Motherboard with Broadcom 5720 Dual Port 1G b On-Board LOM, MLK
338-CHQT : Heatsink for 2 CPU configurati on (CPU less than or equal to 150W)
330-BCCE : Riser Config 6, Low Profile, 1 x16 LP Slots (Gen5) + 1x8 LP S lot (Gen5), 2CPU
325-BEUG : PowerEdge 1U LCD Bezel
210-BFUZ : PowerEdge R660xs